Littelfuse Circuit Protection Devices on ICGOODFIND SiteMap
最新文章
- KEMET Product Lines Explained: A Technical Deep Dive into the T491, T520/T521 Tantalum Series
- TSMC to Build Advanced Packaging Hub in Kaohsiung
- World's First Glass‑Substrate RF Chip Module Enters Mass Production – 2mm × 2mm, 45% Smaller
- AMD Unveils Venice EPYC 9006 – 2nm, 256 Cores, Outperforms Intel and NVIDIA in AI‑Era Server Benchmarks
- Intel CEO: CPU Supply Covers Only 50% of Customer Demand – Warns Against Single‑Foundry Reliance
- Huawei Accelerates Ascend 960 AI Chip Launch – 960DT Now Set for Q1 2027
- Resonac Develops 300mm SiC Single‑Crystal Substrate – Largest Commercial Size in Power Semiconductors
- GlobalWafers Italy Plant Partially Restarts After Fire – 8‑Inch Backend Still Rebuilding
- Altera Prepares IPO to Raise Over $2B – Programmable Chip Maker Returns to Public Markets
- Longsys IPO on Hong Kong Stock Exchange
- MORNSUN Power Modules & Isolated Communication Devices Selection Guide
- Goldman Sachs Raises Optical Module Forecast to $148.5B by 2028 – AI Drives 800G/1.6T/3.2T Surge
- SEMI: Global Semiconductor Equipment Shipments Hit Record $40.5B in Q2 2026 – Up 23% YoY
- AEC‑Q200 Becomes ADAS Gatekeeper – Chinese Inductors Enter High‑Speed Automotive Signal Chains
- Oracle Cuts 3,000 Jobs in India – Restructures for AI While Spending $55.7B on Infrastructure
- Mini-Circuits RF & Microwave Components Guide | Filter, Amplifier, Power Divider, Mixer Selectio
- CXMT Mass-Produces World's First LPDDR6 – Xiaomi 18 Fold Debuts Domestic High-End Memory
- Diodes Q2 Marks Six Consecutive Quarters of Growth – Gross Margin Hits 33.1%
- Intel 18A‑P Process Hits 30% Frequency Boost at 0.5V – Diamond Rapids & Nova Lake First in 2027
- TrendForce: Memory to Take 68% of Cloud CapEx in 2027 – DRAM & HBM Fuel AI Surge
- Avago (Broadcom) Series Overview: Optocouplers, Fiber‑Optic Transceivers & RF Amplifiers
- US Pressures Dutch on DUV Lithography Ban – MATCH Act Targets China Chip Tools
- Yangjie Tech H1 Revenue Hits $633M – Power Semi Surge Across EV, AI, and SiC
- Jingxin Micro Powers Up Two RapidIO Chips – 600Gbps Switch & PCIe Bridge for AI Compute
- Cypress Semiconductor Chip Selection Guide|FRAM, USB Controller & PSoC Programmable SoC Overview
- Samsung Raises Advanced Foundry Prices Up to 15% – AI Demand Tightens 4nm/5nm Supply
- YMTC IPO Passes Key Milestone – Regulatory Review Completed for NAND Giant
- Rockchip H1 Profit Jumps 62% to Record High – Edge AI Drives 40% Revenue Growth
- 2026 IC Supplier Risk Matrix: Lead Time Delay & Price Hike Risk Ranking of Major Chip Vendors
- Tier IV to Open‑Source Its Automotive AI Chip Design – Free NPU Blueprint by 2027
- Kioxia & Sandisk Launch 9th‑Gen 2Tb QLC 3D NAND – 4.8Gb/s Interface, 33% Faster
- Vishay Q2 2026 Revenue Hits $918.6M – Book-to-Bill 1.32 on AI Server Component Boom
- China Bypasses EUV Lithography – Vertical Graphene Transistor Hits 132GHz for 6G Chips
- Taiyo Yuden Q2 MLCC Profit Surges 53.5% – AI Servers Drive Capacity Crunch
- Google AI Legends Leave to Launch Discovery Loop – A New Era in Automated Science
- onsemi Q2 Beats Estimates – AI Server Power Revenue Doubles to $500M in 2026
- TFME Establishes $140M Shenzhen Subsidiary – Expanding Beyond Packaging into Full Semiconductor Chain
- AOS Rolls Out AmpStack Vertical-Stack 80V Half-Bridge MOSFET – Replaces Two DFN5x6 Chips
- Navitas Q2 Revenue Jumps 22% QoQ – AI Data Center Power Drives Strategic Pivot
- Lattice Semiconductor Chip Series Overview | CPLD / FPGA / Power Management IC Application Guide
- Taiyo Yuden to Raise MLCC Prices Again in September – Second Hike This Year
- CXMT Surges Past $50B Market Cap on STAR Market Debut – Overtakes Intel & Tencent
- Broadcom Popular Communication Chips Cheat Sheet for Hardware Engineers | PHY, Switch, Automotive, Gateway
- TSMC to Raise Foundry Prices Up to 25% in 2027 – HPC Orders Face Premium
- ASML High-NA EUV Components Arrive in Albany – U.S. R&D Gets Next-Gen Lithography Boost
- Kyocera CEO: Semiconductor Parts Boom to Last Until 2030 – Ceramic & MLCC Capacity Ramping
- AOS Alpha & Omega Semiconductor Full Product Line Overview: Popular MOSFET & Power IC Selection Guide
- TFME H1 Profit Soars Up to 337% – AI & Storage Demand Fuel Packaging Boom
- World’s First 8-Inch 2D Semiconductor Pilot Line Goes Live in Shanghai
- Samsung Tapes Out Tesla AI5 Chip on 2nm at Taylor Fab – Mass Production Set for 2027
- Silex Buys ON Semi’s 200mm U.S. Fab for $40M – MEMS Capacity Play
- 2026 Hot IoT Module Combo: U-BLOX GNSS Positioning Modules + SIMCOM 2G Cellular Modules
- Designing a Robust Offline Switched-Mode Power Supply with the onsemi NCP1200D100R2G PWM Current-Mode Controller
- onsemi FDG6332C: A Comprehensive Technical Overview of the Dual N-Channel Logic Level MOSFET
- MMBT5550LT1G NPN Bipolar Junction Transistor: Datasheet, Pinout, and Application Circuits
- Onsemi FGH40T120SMD: A Comprehensive Technical Overview of the 1200V, 40A IGBT
- Onsemi UC2844BD1R2G: High-Performance Current Mode PWM Controller for Switch-Mode Power Supplies
- Onsemi NSI45020T1G: A Comprehensive Analysis of Its Constant Current Regulation and Circuit Protection Features
- Onsemi BAT54SLT1G Schottky Barrier Diode: Characteristics and Applications
- onsemi NCP361SNT1G: High-Performance, Low-Voltage Dual Comparator
- YAGEO Resistor & Capacitor Product Line Introduction | Full Coverage of Common Models
- Yongxi Electronics Bets $1.4B on Advanced IC Packaging Megaproject – Will 8-Year Payoff Justify the Gamble?
- Qualcomm in Talks to Custom‑Design ASIC Chip for ByteDance
- Nearfield Instruments Raises $380M Series D – Largest Dutch Deep‑Tech Round Ever
- KYOCERA AVX Tantalum Capacitor Guide | Prefix Meaning, Key Parameters & Popular Models
- Nations Technologies Surges 20% on CPO MCU Roadmap for AI Optical Interconnects
- ICGOODFIND: Electronic Component & IC Purchasing Guide | Essential Skills & Practical Tips for Beginners
- WinCO Nova 1000mW Single‑Mode 980nm Pump Laser Chip Breaks Global Monopoly
- ICgoodFIND 2026 Duanwu Festival Holiday Notice
- Bourns Popular Components Overview | Reference Guide for Engineers: Trimmers & Circuit Protection Devices
- Nokia Expands Pennsylvania Photonics Plant to Power AI Interconnect, Adds 250 Jobs
- Qualcomm in Talks to Acquire AI Chip Startup Tenstorrent for Up to $10 Billion
- Nvidia Pitches Vera CPU to China Clients: 88‑Core Arm Chip Launching August 2026
- SK Hynix to Triple Wafer Capacity by 2034, Picks Japan for First Overseas Fab
- Moore Threads Open‑Sources MusaCoder: LLM for GPU Kernel Generation, Trained Entirely on Domestic GPUs
- Samsung Plans New Advanced Packaging Plant in Gwangju to Boost HBM and AI Chip Capacity
- JCET Launches 3D Power Module Packaging Solution for AI Data Centers
- Nvidia’s New Vera CPU Picks SK Hynix DRAM as Memory Supplier
- TI DSP Chip Overview: Features & Typical Applications of Popular TMS320 Series Models
- SK Group Halts SK Siltron Sale at Final Stage, Citing Supercycle and AI Strategy
- Geehy Launches Three G32A Auto MCUs – Mass Production for Body, Lighting, Thermal Management
- Guide to VISHAY Component Naming Rules & Practical Device Selection
Preface
- STMicro and Arm Raise Forecasts on AI Infrastructure Boom – ST Sees $1B Data Center Revenue in 2026
- NXP S9S08AW16AE0CLC: A Comprehensive Technical Overview of the 8-bit HCS08 Microcontroller
- NXP S9KEAZ128ACLHR: A Comprehensive Technical Overview of the ARM Cortex-M0+ Based Microcontroller
- NXP TJA1021T/10/CM,118: A Comprehensive Technical Overview of the LIN Network Bus Transceiver
- NXP TJA1041: A High-Performance CAN Transceiver for Automotive Network Applications
- NXP TJA1043T118: A High-Performance CAN Transceiver for Automotive Networks
- NXP S9KEAZ64ACLH: A Comprehensive Technical Overview of the ARM Cortex-M0+ Based Microcontroller
- NXP TJA1028TK/3V3/20:1: A Comprehensive Technical Overview of the LIN System Basis Chip
- NXP TJA1021TK/10/C,118 LIN 2 Transceiver: Key Features, Applications, and Technical Overview
- Nuvoton NAU8421YG: 24‑Bit Stereo DAC with 128dB SNR, –99dB THD+N
- Marvell Q1 Revenue Hits Record $2.418B, Net Income Falls 81% on Acquisition Costs
- The NXP T2080NSE8TTB is a high-performance, multicore communications processor belonging to the QorIQ T-series family, built on Power Architecture® technology. This specific part number denotes a devi
- The NXP S9S12XS256J0CALR is a member of the HCS12X family of 16-bit microcontrollers, built on a powerful CPU12X core that extends the legacy of the popular HCS12 architecture. This specific device is
- NXP SPC5602BK0CLH4 32-Bit Microcontroller for Automotive Body Control Applications
- NXP T1024NSN7KQA: A High-Performance Embedded Processor for Advanced Networking and Industrial Applications
- The NXP SPC5742PFK1AMLQ9: A High-Performance 32-bit MCU for Automotive Safety and Powertrain Systems
- NXP SSL4120T: A Highly Integrated Switched-Mode Power Supply (SMPS) Controller IC for High-Efficiency Applications
- NXP S9S12ZVL16F0WLF: A Comprehensive Technical Overview of the 16-bit HCS12Z Microcontroller Family